Welcome to The 7th ICMLSC 2023

International Conference on Machine Learning and Soft Computing

  • 第七届机器学习与软计算国际会议 欢迎您!| 中国 重庆, 1月5-7日

ICMLSC 2023, The 7th International Conference on Machine Learning and Soft Computing, will take place at Chongqing, China from January 5-7, 2023. This year's conference is sponsored by Chongqing University of Posts and Telecommunications, China, supported by Chongqing University, China; Hainan Association for Artificial Intelligence, China; Sai Gon University, Vietnam; Can Tho University, Vietnam; Hosei University, Japan; Chuo University, Japan, etc.

For the past 6 years, ICMLSC went virtual in 2021&2022 (due to the impact of COVID-19), and went to Haiphong City, Da Lat, Phu Quoc Island and Ho Chi Minh City in 2017-2020. This conference is highlighted by more and more audiences who joined us. We look forward to your participation and continued engagement at future ICMLSC series.

The organizing committee will not ask delegates to provide credit card information for any purpose. The registration will be completed only via conference system.

ICMLSC Call For Papers Flyer





Track 1: Data Science and Computing
Chairs: Prof. Xiangjie Kong, Zhejiang University of Technology, China
Prof. Naoyuki Ishimura, Chuo University, Japan
Prof. Takahiko Fujita, Chuo University, Japan

Track 2: Artificial Intelligence and Digital Transformation
Chairs: A/Prof. Chengming Li, Sun Yat-Sen University, China
A/Prof. (HDR) Hiep Xuan Huynh, Can Tho University, Vietnam
A/Prof. Nhat Minh Viet Vo, Hue University, Vietnam


Track 3: Intelligent Computing and Application
Chairs: Prof. Xiaojie Wang, Chongqing University of Posts and Telecommunications, China
Prof. Pham The Bao, Sai Gon University, Vietnam

Track 4: Image Processing and Recognition
Chairs: Prof. Chengchao Liang, Chongqing University of Posts and Telecommunications, China
Prof. Huynh Trung Hieu, Industrial University of Ho Chi Minh City, Vietnam

Important Dates

Deadline for Paper Submission - December 05th, 2022

Deadline for Final Registration - December 22nd, 2022

Conference Dates - January 5-7, 2023


Full Paper submitted and accepted after successful registration will be published by ACM Conference Proceedings (ISBN: 978-1-4503-9864-0). Papers presented in this conference will also be submitted for inclusion in Ei Compendex, Scopus.
被录用并报告的文章将一如既往地由ACM会议论文集出版, 于会后提交Ei核心检索。

Special Issue

Selected paper within the topics will be recommended to World Electric Vehicle Journal
Special Issue "Security and Privacy for B5G Internet of Vehicles" via https://www.mdpi.com/journal/wevj/special_issues/YUQP7PB0UK
High Visibility: indexed within Scopus, ESCI (Web of Science), Ei Compendex

Previous ICMLSC


ISBN: 978-1-4503-8747-7


ISBN: 978-1-4503-8761-3


ISBN: 978-1-4503-7631-0


ISBN: 978-1-4503-6612-0


ISBN: 978-1-4503-6336-5


ISBN: 978-1-4503-4828-7

Sponsored by
Supported by